PRODUCT DESCRIPTION:
Plastronics now offers .75 mm pitch test and burn-in sockets for fine pitch BGA and CSP packages. Witness marks on tested packages show excellent contact with the small solder balls associated with CSP packages while maintaining no deformation on the lower 50% of the solder ball.
SPECIFICATIONS (mm):
• Up to 10 x 19 Matrix
• Grid Array Pitch .75 x .75
• Max IC Size 10.20 x 20.0
• Solder Ball Size: .30 +/- .05
.35 +/- .05
.45 +/- .05
• Cover Actuation Force 1.19 Kg (avg.)
MECHANICAL PROPERTIES:
• Mounting Method to Board: Thru-hole Mount
• Socket Operation: ZIF (Push cover 3 mm stroke)
• Operating Temperature: -65°C to +150°C
• Contact Force: 10+/- 3 gf
• Life Cycles: 10,000 Mechanical Cycles PHYSICAL PROPERTIES:
• Plastic Body: PEI
• Plastic Grid Plates: PEI
• Contact Base Metal: BeCu
• Contact Plating: Au over Ni
ELECTRICAL PROPERTIES:
• Contact Resistance: < 50 mOhm
• Inductance: < 6 nH
• Capacitance: < 2.59 pF
• Current Rating: 1A
• Volume Resistivity: 1,000 MOhm @ 100 VDC
• Insulation Resistance: 100 VAC for 1 minute
DETAIL DRAWINGS:
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